For a satisfactory operation of the memory, a number of timing conditions must be observed. Figure 3.31 shows the sequence of a write operation. To prevent the data being written into the wrong cell, the write command must not be applied until a certain time has elapsed after definition of the address. This time is called the address setup time tAS . The duration of the write pulse must not be less than the minimum value tWP (write pulse width). The data are read in at the end of the write pulse. They must be valid, i.e. stable, for a minimum period prior to this. This time is called tDW (Data Valid to End of Write). In a number of memories the data and addresses must also be present for a further time tH after the end of the write pulse (Hold Time). As can be seen from Fig. 3.6, the time required to execute a write operation is expressed as
tW = tAS + tWP + tH
This is referred to as the Write Cycle Time.
Fig. 3.31 - Timing of a write operation.
tAS = Address Setup Time
tWP = Write Pulse Width
tDW = Data Valid to End of Write Time
tH = Hold Time
Fig. 3.32 - Timing of a read operation.
tAA = Address Access Time
The read operation is shown in Fig. 3.32. After the address is applied, it is necessary to wait for time tAA until the data at the output are valid. This time is referred to as the Address Access Time or simply Access Time.
A list of some of the most widely-used static RAMs in bipolar and CMOS technology is given in Fig. 3.33
Capacity
Organization
Type
Manufacturer
Operating power, typical
Access time, max.
Pins
CMOS: (VDD =5V, f = fmax)
16 kbit
2k x 8
Hi, Ne, To
160 mW
100ns
2k x 8
DS12201
Da
250 mW
150ns
4k x4
Id, Mh, Cy, Is
225 mW
15ns
16k x 1
200 mW
12ns
64 kbit
8k x 8
Hi, Ne, To
200 mW
100ns
8k x 8
DS12251
Da
200 mW
150ns
8k x 8
Id, Mh, Cy, Is
250 mW
20ns
4k x 16
Id, To
900 mW
25ns
16k x 4
Id, Mh, Cy, I
300 mW
15ns
64k x 1
Id, Mh, Cy, Is
250 mW
15ns
256 kbit
32k x 8
Hi, Ne, To, Fu
300 mW
100ns
32k x 8
DS12301
Da
300 mW
150ns
32k x 8
Id, Hi, Ne, Cy, Mh
250 mW
35ns
64k x 4
Id, Hi, Ne, Cy, Mh
350 mW
25ns
256k x 1
Id, Hi, Ne, Cy, Is
350 mW
25ns
1 Mbit
128k x 8
Hi, Ne, To, Fu
250 mW
70ns
128k x 8
DS12451
Da
250 mW
70ns
128k x 8
Id, Hi, Ne
500 mW
35ns
256k x 8
Id, Hi, Ne
500 mW
35ns
1024k x 1
Id, Ne
500 mW
35ns
4 Mbit
512k x 8
To
350 mW
30ns
512k x 8
CYM
14642
Cy, Id
1200mW
45ns
256k x 16
CYM
16412
Cy.Id
6000 mW
25ns
8 Mbit
1024k x 8
MS810002
Hm
300 mW
85ns
256k x 32
CYM18412
Cy
4000 mW
35ns
ECL: (VEE = - 5.2 V)
1 kbit
256k x 4
Cy, Ne
1000 mW
3 ns
4 kbit
1k x 4
Cy,Ne
1200 mW
3 ns
4k x 1
Fu, Ne
900 mW
7 ns
16 kbit
4k x 4
Fu, Hi
1300 mW
8ns
16k x 1
Fu, Hi, Ne
1100 mW
8ns
64 kbit
16k x 4
Id, Cy, Fu, Ne, Na
600 mW
8ns
64k x 1
Id. Cy, Fu, Ne
420 mW
8ns
256 kbit
64k x 4
Fu, Na, Hi, Id
1000 mW
15ns
256k x 1
Fu, Na, Hi, Ne
800 mW
15ns
Fig. 3.33 - Examples of static RAMs.
1 Containing lithium battery; data retention: 10 years
2 Hybrid circuit (module)
Manufacturers: Cy = Cypress, Da = Dallas, Fu = Fujitsu, Hi = Hitachi, Hm = Hybrid Memory, Id = IDT, Is = Inmos, Mh = Matra Harris, Na = National, Ne = NEC, St = SGS-Thomson, To = Toshiba, Vt = VTI