Time permitting, I prefer to check a translation at least a day after I completed the first translation. I find that the quality of the checking process improves significantly by letting the document sit overnight. I used to be an adherent of the inherited wisdom that on-screen checking is more difficult and not as good as checking a printed out version of a translation. I have since overcome that aversion to screen checking, while maintaining the understanding of the need to be very careful when checking a displayed document.
Summary
The foregoing is just a very brief outline of the process of taking a patent specification translation job to completion. Other translators will do different things during the translation process. I presented this tour as just one example of how one translator works.
Ex.13. Translate the following phrases into Ukrainian:
go into much detail
newcomers to patent translation
to take a peek at
identifying customer requirements
a physical check of the manuscript content
mark the end of all non-last sentences
relevant patents
valuable background information and clues
with the subject matter of a particular invention
a brief skim through the document
eliminate some of the drudgery of typing
a standard set of abbreviations
let the document sit overnight
aversion to screen checking
Ex.14. Translate the following abbreviation lists from the above text into Ukrainian.
Job-Specific Abbreviation List My Standard Abbreviation List
1. btr
bipolar transistor
1. aaoo
according to any one of claim
2. cho
contact hole
2. aar
as a result,
3. cpa
current path
3. abd
above-described
4. fetr
field effect transistor
4. abn
above-noted
5. gof
gate oxide film
5. aopri
accordingly, it is an object
of the present invention
6. gte
ground terminal
6. api
according to the present invention
7. ici
internal circuit
7. asif
as shown in Fig.
8. icla
interconnect layer
8. atc
according to claim
9. idr
impurity diffusion region
9. bdt
by doing this,
10. ifi
insulation film
10. cdi
circuit diagram
11. ilifi
interlayer insulation film
11. csv
cross-sectional view
12. ite
input terminal
12. em
embodiment
13. jre
junction resistance
13. epi
Embodiments of the present invention are described in details below, with reference made to relevant accompanying drawings.
14. lpa
layout pattern
14. fex
For example,
15. ntw
n-type well
15. fi
FIG.
16. nty
n-type
16. ftr
For this reason
17. ofi
oxide film
17. iadi
is a drawing illustrating
18. pci
protective circuit
18. iads
is a drawing showing
19. pel
pad electrode
19. ipa
In particular,
20. pele
protective element
20. itciw
in the case in which
21. pst
power supply terminal
21. itm
In this manner,
22. psu
power supply
22. its
in this case
23. ptw
p-type well
23. itsm
in the same manner
24. pty
p-type
24. iwbut
it will be understood that
25. sch
semiconductor chip
25. iwi
in which
Ex.15. Discuss in groups:
Comment on the steps the Japanese translator does before, during and after the translation.
Are there steps that you find useful an appropriate for you?