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Application Drivers and InterfacesThe process of selecting materials, packages, processes and techniques for MEMS is driven by the end item application. For example, in an RF end item application, a major design problem is to have controlled impedance of the input and output signals. Therefore, the package should not limit the electrical performance of the MEMS components. Another application driven requirement is the need for hermeticity. Designers must decide if their components need to be isolated from oxygen, nitrogen, ambient
moisture, etc. before making a decision on what level of hermetic packaging is necessary. For example, ambient moisture often deteriorates MEMS devices, however, in the instance the package needs only to be a dry package and not fully hermetic. Then, the use of appropriate getters will suffice; but if long-term reliability is a requirement, the packages still need to be near hermetic since the getters have a limited capacity [1]. Figure 12.1 shows a variety of ceramic package structures for sensor applications. 12.1.4 Interfaces to Other System Components As the package is the primary interface between the MEMS and the system, it must be capable of transferring operating power and a multitude of signals. In addition, the package may be required to distribute both operating power and other signals to other components inside the package. The integration of more MEMS devices and 12.1.4.1 Power and Signals Interface When designs require high frequency RF signals, they can be introduced into the package along metal lines passing through the package walls, or they may be elec-tromagnetically coupled into the package through apertures in the package walls. RF energy losses between the MEMS device and the system can be due to radiation, by reflection from components that are not impedance matched, or from discontinuities in the transmission lines. The final connection between the MEMS and the DC and RF lines is usually made with wire or ribbon bonds; although flip-chip die attachment and multi-layer interconnects, using thin dielectrics have also been used. Date: 2015-02-28; view: 1288
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